Ying-Cheng Wu is a prominent inventor based in Miao-Li, Taiwan. He has made significant contributions to the field of digital camera technology, holding a total of 14 patents. His work focuses on enhancing the functionality and efficiency of digital camera modules.

Latest Patents

Among his latest patents is a digital camera module using a stacked chip package. This innovative design includes a chip package and a lens module mounted on the chip package. The chip package consists of a substrate, a first chip, a second chip, and a cover. The first chip is mounted on the substrate and is electrically connected via a first plurality of wires. The second chip is positioned above the first chip and the wires connected to it, ensuring efficient electrical connections. The cover is mounted above the second chip and the associated wires. Another notable patent is a digital camera module packaging method. This method involves providing a carrier with a base that defines a chamber and a lead frame. The lead frame contains conduction pieces embedded in the base, facilitating the connection of an image sensor chip with a photosensitive area to the carrier.

Career Highlights

Ying-Cheng Wu is currently associated with Altus Technology Inc., where he continues to innovate in the field of digital imaging. His expertise and dedication have led to advancements that benefit both consumers and the technology industry.

Collaborations

He has collaborated with notable coworkers, including Steven Webster and Kun-Hsieh Liu, contributing to various projects that enhance digital camera technology.

Conclusion

Ying-Cheng Wu's contributions to digital camera technology through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence advancements in imaging technology.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com