Altus Technology Inc.

Ying-Cheng Wu

Steven Webster

Kun-Hsieh Liu

Po-Chih Hsu

Ching-Lung Jao

Ying-Tang Su

Chun-Hung Lin

Yuan-Po Wang

A chip package () and a lens module () mounted on the chip package are provided. The chip package includes a substrate (), a first chip (), a second chip (), and a cover (). The first chip is mounted on the substrate and is electrically connected with the substrate via a first plurality of wires (). The second chip is mounted above the first chip and above the wires connected with the first chip and is electrically connected with the substrate via a second plurality of wires (). The cover is mounted above the second chip and the wires connected with the second chip.

Digital camera module using stacked chip package

A digital camera module packaging method includes: first, providing a carrier () including a base () defining a chamber () and a lead frame (). The lead frame has a plurality of conduction pieces () embedded in the base. One end of each conduction piece is exposed at one surface of the base, and another end of the conduction piece is exposed at another surface of the base. An image sensor chip () with a photosensitive area () and a plurality of chip pads () is then mounted in the chamber. A plurality of wires () is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one exposed end of a corresponding conduction piece of the carrier. A holder () is then provided. The carrier is mounted to the holder. Finally, a lens module () is mounted on the holder.

Digital camera module packaging method

A digital camera module () includes a lens holder (), a lens module () received in the lens holder, and an image sensor chip package () mounted to the lens holder. The lens module includes a lens barrel () movably engaged in the lens holder and at least one lens () received in the lens barrel. The image sensor chip package includes a base (), an image sensor chip () mounted on the base, a transparent cover (), and an adhesive () positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.

Digital camera module with small sized image sensor chip package

An image sensor package () includes a base board (), a supporter (), an image sensor (), a plurality of wires (), a main adhesive () and a cover board (). The supporter includes a through hole and a plurality of top pads () formed around the through hole, and the supporter is mounted on the base board and electrically connected to the base board. The image sensor is mounted on the base board and received in the through hole, and the image sensor includes a sensing portion () and a plurality of contacts (). The wires electrically connect the top pads to the contacts. The main adhesive is applied on the image sensor and surrounds the sensing portion. The cover board supported on the main adhesive, and the cover board and the main adhesive cooperatively enclose the sensing portion of the image sensor.

Image sensing module with improved assembly precision

An image sensor chip packaging method includes: first, providing a carrier (). The carrier includes a base () and a lead frame (). The base has a chamber () defined therein. The lead frame has a plurality of conduction pieces (). The conduction pieces of the lead frame are embedded in the base and are spaced from each other. An image sensor chip () is then mounted in the chamber. The image sensor has a photosensitive area () and a plurality of chip pads (). A plurality of bonding wires () is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one of the exposed ends of a corresponding conduction piece of the carrier. A holder () having a holding cavity () is then provided. Finally, the carrier is then mounted in the holding cavity of the holder.

Image sensor chip packaging method

An image sensor package method includes the steps of: first, providing a carrier (), which includes a base () and a leadframe (). The base has a cavity therein and the leadframe includes a number of conductive pieces; Second, mounting an image sensor chip on the base and received in the cavity, the image sensor having a photosensitive area. Third, providing a plurality of wires, each electrically connects the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourth, applying an adhesive means around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover on the carrier, where an adhesive means fixes the cover in place.

Image sensor chip package fabrication method

A chip package () includes a carrier (), a chip (), a second conductive means () and a transparent cover (). The carrier () includes a base (). The chip is mounted on the base and has an active area (). The second conductive means electronically connects the chip with the conductive means. The first adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover is adhered with the first adhesive means so as to define a sealing space () for sealing the active area of the chip therein. It can be seen that the active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.

Image sensor chip package

A digital still camera module includes an image sensor package () and a lens barrel () mounted on the image sensor package. The image sensor package includes a substrate (), an image sensor chip (), and a cover (). The substrate defines a receiving chamber () therein. The image sensor chip mounted in the receiving chamber of the substrate. The cover, which is transparent and has a smaller profile than that of the substrate, is secured to the top portion of the substrate thereby sealing the receiving chamber. The top portion of the substrate has an uncovered section () at a periphery of the cover. The lens barrel includes at least one lens () received therein. The lens barrel is securely attached to the uncovered section of the top portion of the substrate.

Digital still camera module

A testing system () for digital camera modules () includes a first testing module (), an assembling mechanism (), a focusing module (), a second testing module (), a carrying mechanism (), and a main processor (). The carrying mechanism supports and transports subassemblies of the digital camera modules and the digital camera modules between the first testing module, the assembling mechanism, the focusing module and the second testing module. The first testing module, the assembling mechanism, the focusing module, the carrying mechanism, and the second testing module are all electronically connected with the main processor.

Testing system for digital camera modules

A digital camera module () includes a lens barrel (), a lens holder (), an image pick-up module (), and a protective member. The lens barrel defines a central hollow, and has at least one lens () received therein. The lens holder defines a central hollow. The lens barrel is movably received in the lens holder along an axis of the lens holder. The image pick-up module is arranged to receive light from the lenses. The protective member is configured for preventing dust and/or particle contamination associated with a relative movement of the lens barrel and the lens holder falling onto the image pick-up module.

Digital camera module with improved image quality

An IC (integrated circuit) chip package includes a substrate (), a chip (), a plurality of bonding wires (), and a cover (). The substrate has a top surface, a bottom surface, a receiving chamber () defined therein, a plurality of solder pads () arranged around the top surface and the bottom surface, and a plurality of vias () having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate to cover the opening, and has a smaller profile than that of the substrate, thereby not cover a peripheral area of the top surface.

IC chip package with cover

A digital camera module () includes a carrier (), an image sensor chip (), a number of wires (), a holder (), and a lens module (). The carrier includes a base () and a leadframe () embedded in the base. The base includes a board (), a sidewall () and a cavity (). The leadframe includes a number of conductive leads () spaced from each other. Each lead has a first terminal portion (), a second terminal portion (), and an interconnecting portion () connecting the first and second terminal portions. The chip is mounted on the carrier, and has an active area (). The wires electrically connect the chip and the leadframe. The holder is mounted to the carrier to close the cavity. The lens module is received in the holder and guides light to the active area of the chip.

Digital camera module

An IC chip package includes a substrate (), a chip (), a plurality of bonding wires (), and a cover (). The substrate has a top surface, a receiving chamber () having an opening at the top surface, a plurality of solder pads () arranged around the top surface and respectively corresponding to the solder pads arranged at a bottom surface opposite to the top surface, and a plurality of vias () having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads () arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate, and covers the opening.

IC chip package with isolated vias

A digital camera module package method includes the steps of: firstly, providing a carrier (), which includes a base () and a leadframe (). The base has a cavity therein and the leadframe includes a number of conductive pieces (); Secondly, mounting an image sensor chip () on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires (), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means () around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover () on the carrier, where an adhesive means fixes the cover in place.

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Miao-Li, Taiwan

Ying-Cheng Wu