The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2008

Filed:

Jun. 14, 2006
Applicants:

Steven Webster, Miao-li, TW;

Ying-cheng Wu, Fullerton, CA (US);

Kun-hsieh Liu, Miao-li, TW;

Inventors:

Steven Webster, Miao-li, TW;

Ying-Cheng Wu, Fullerton, CA (US);

Kun-Hsieh Liu, Miao-li, TW;

Assignee:

Altus Technology Inc., Chu-Nan, Miao-Li Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01); H01J 5/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A digital camera module package method includes the steps of: firstly, providing a carrier (), which includes a base () and a leadframe (). The base has a cavity therein and the leadframe includes a number of conductive pieces (); Secondly, mounting an image sensor chip () on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires (), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means () around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover () on the carrier, where an adhesive means fixes the cover in place.


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