The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2009

Filed:

Nov. 10, 2006
Applicants:

Steven Webster, Miao-li, TW;

Ying-cheng Wu, Miao-li, TW;

Kun-hsieh Liu, Miao-li, TW;

Inventors:

Steven Webster, Miao-li, TW;

Ying-Cheng Wu, Miao-li, TW;

Kun-Hsieh Liu, Miao-li, TW;

Assignee:

Altus Technology Inc., Chu-Nan, Miao-li Hsien, unknown;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
Abstract

An image sensor chip packaging method includes: first, providing a carrier (). The carrier includes a base () and a lead frame (). The base has a chamber () defined therein. The lead frame has a plurality of conduction pieces (). The conduction pieces of the lead frame are embedded in the base and are spaced from each other. An image sensor chip () is then mounted in the chamber. The image sensor has a photosensitive area () and a plurality of chip pads (). A plurality of bonding wires () is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one of the exposed ends of a corresponding conduction piece of the carrier. A holder () having a holding cavity () is then provided. Finally, the carrier is then mounted in the holding cavity of the holder.


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