Company Filing History:
3 out of 7,087 
3 out of 40,850 
Years Active: 2000-2024
Title: Yii-Chian Lu: Innovator in Semiconductor Technology
Introduction
Yii-Chian Lu is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on improving heat dissipation in semiconductor packages, which is crucial for enhancing the performance and reliability of electronic devices.
Latest Patents
One of his latest patents is titled "Heat dissipation in semiconductor packages and methods of forming same." This invention describes a semiconductor package that includes a first package component comprising a first semiconductor die, a first encapsulant around the die, and a first redistribution structure electrically connected to the semiconductor die. The package also features a second component bonded to the first, which includes a second semiconductor die, a heat spreader positioned between the first semiconductor die and the second package component, and a second encapsulant that has lower thermal conductivity than the heat spreader. This innovative design aims to enhance heat management in semiconductor devices.
Career Highlights
Throughout his career, Yii-Chian Lu has worked with notable companies in the semiconductor industry, including United Microelectronics Corporation and Taiwan Semiconductor Manufacturing Company Limited. His experience in these organizations has allowed him to develop and refine his expertise in semiconductor packaging and thermal management.
Collaborations
He has collaborated with talented individuals such as Fang-Mei Chao and Chih-Nan Cheng, contributing to various projects that advance semiconductor technology.
Conclusion
Yii-Chian Lu's innovative work in semiconductor packaging and heat dissipation has made a significant impact on the industry. His patents reflect his commitment to enhancing the performance of electronic devices through effective thermal management solutions.