Yi-Ling Hsieh

This inventor holds 5 USPTO granted patents. Top assignees: Chipbond Technology Corporation, Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2016-2026.

USPTO Granted Patents = 5

% Patents Active = 80.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)

Company Filing History:

4 out of 92

Chipbond Technology Corporation

patents

1 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2016-2026

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5 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12707564 - Flexible circuit board (2026-08-11),

2. 12564056 - Inner lead structure of flexible circuit board (2026-02-24),

3. 12550764 - Layout structure of flexible circuit board (2026-02-10),

4. 11503698 - Flexible circuit board and heat spreader thereof (2022-11-15),

5. 9529250 - EUV mask with ITO absorber to suppress out of band radiation (2016-12-27),

Profile summary based on public USPTO records.

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