The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Mar. 28, 2024
Applicant:
Chipbond Technology Corporation, Hsinchu, TW;
Inventors:
Ting-Yi Kuo, Kaohsiung City, TW;
Yi-Ling Hsieh, Kaohsiung City, TW;
Chiu-Hung Lai, Kaohsiung City, TW;
Assignee:
CHIPBOND TECHNOLOGY CORPORATION, Hsinchu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/03 (2006.01); H05K 3/3465 (2026.01);
U.S. Cl.
CPC ...
H05K 1/0393 (2013.01); H05K 3/3465 (2026.01); H05K 2201/09045 (2013.01); H05K 2201/09781 (2013.01); H05K 2203/0562 (2013.01);
Abstract
A flexible circuit board includes a flexible substrate, circuit lines, a solder resist layer and shaping strips. The flexible substrate has a first part and a second part which is wider than the first part and easy to be bent. The circuit lines are arranged on the flexible substrate and covered by the solder resist layer. The shaping strips are arranged on the solder resist layer located on the second part and are provided to help to shape the bent second part back to the original one as flat pressing the flexible circuit board.