This inventor holds 1 USPTO granted patent. Top assignee: Chipbond Technology Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Ting-Yi Kuo and Flexible Circuit Board Innovation.
Introduction
Ting-Yi Kuo is an inventor associated with Kaohsiung City, Taiwan. His work includes a patent for a flexible circuit board designed to help a bent section return to a flat shape.
Latest Patents
Kuo’s listed patent, “Flexible Circuit Board,” describes a flexible substrate with a narrower first part and a wider, bendable second part. Circuit lines are arranged on the substrate and covered by a solder resist layer. Shaping strips placed over the solder resist on the wider section help it return to its original flat form when the board is pressed flat. Kuo is credited with 1 patent.
Career Highlights
Kuo is associated with Chipbond Technology Corporation. His patented design addresses the shaping and handling of flexible circuit boards.
Collaborations
Kuo’s coworker Chiu-Hung Lai is also associated with the patent.
Conclusion
Ting-Yi Kuo’s flexible circuit board patent presents a practical approach to restoring a bent section to a flat shape, reflecting his contribution to circuit-board design.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile