This inventor holds 1 USPTO granted patent. Top assignee: Chipbond Technology Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Chiu-Hung Lai: Inventor of a Flexible Circuit Board
Introduction
Chiu-Hung Lai is an inventor associated with Kaohsiung, Taiwan, and Chipbond Technology Corporation. His work includes an invention designed to improve the shaping and handling of flexible circuit boards.
Latest Patents
Lai is associated with 1 patent, titled “Flexible Circuit Board.” The invention describes a flexible substrate with a narrower first part and a wider, bendable second part. Circuit lines are arranged on the substrate and covered by a solder resist layer. Shaping strips placed over the solder resist on the wider section help the bent portion return to its original flat shape when the board is pressed flat.
Career Highlights
Lai’s patent focuses on a practical challenge in flexible circuit board design: helping a bent section recover its shape. The shaping strips are intended to support this function while the circuit lines remain protected beneath the solder resist layer.
Collaborations
Lai is associated with Chipbond Technology Corporation. His coworker Ting-Yi Kuo is also identified in connection with his professional network.
Conclusion
Chiu-Hung Lai’s flexible circuit board patent presents a design approach for restoring a bent section to a flat shape, reflecting his contribution to electronic component innovation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile