The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Mar. 25, 2024
Chipbond Technology Corporation, Hsinchu, TW;
Hou-Chang Kuo, Kaohsiung, TW;
Wen-Ping Hsu, Kaohsiung, TW;
Ting-Yi Kuo, Kaohsiung, TW;
Yi-Ling Hsieh, Kaohsiung, TW;
CHIPBOND TECHNOLOGY CORPORATION, Hsinchu, TW;
Abstract
A layout structure of a flexible circuit board includes a flexible substrate, a circuit layer and a dummy circuit layer which are arranged on the flexible substrate. The circuit layer includes first inner leads, second inner leads, an inverted U-shape connection line and a horizontal inner lead. A first distance between the first inner leads is less than a second distance between the second inner leads. One of dummy leads of the dummy circuit layer is located between the first and second inner leads, another dummy lead is located between the second inner leads. The dummy leads are provided to allow lead spaces on both sides of the inverted U-shape connection line is the same. Thus, etching solution will not flow laterally in an etching space between the inverted U-shape connection line and the horizontal inner lead.