This inventor holds 1 USPTO granted patent. Top assignee: Chipbond Technology Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Innovations of Wen-Ping Hsu
Introduction
Wen-Ping Hsu is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of flexible circuit board technology. His innovative designs have led to advancements in electronic components, enhancing their functionality and efficiency.
Latest Patents
Wen-Ping Hsu holds a patent for a layout structure of a flexible circuit board. This patent includes a flexible substrate, a circuit layer, and a dummy circuit layer arranged on the flexible substrate. The circuit layer features first inner leads, second inner leads, an inverted U-shape connection line, and a horizontal inner lead. Notably, the first distance between the first inner leads is less than the second distance between the second inner leads. The design incorporates dummy leads to ensure uniform lead spaces on both sides of the inverted U-shape connection line, preventing lateral flow of etching solution during the manufacturing process.
Career Highlights
Wen-Ping Hsu is associated with Chipbond Technology Corporation, where he has been instrumental in developing cutting-edge technologies. His work has contributed to the company's reputation as a leader in the semiconductor industry.
Collaborations
Wen-Ping has collaborated with talented individuals such as Hou-Chang Kuo and Ting-Yi Kuo, who have also contributed to various projects within the company.
Conclusion
Wen-Ping Hsu's innovative work in flexible circuit board technology exemplifies the impact of dedicated inventors in advancing electronic components. His contributions continue to influence the industry positively.