Yi-Jou Lin

Title: Yi-Jou Lin: Innovator in Semiconductor Packaging

Introduction

Yi-Jou Lin is a prominent inventor based in Hsinchu, Taiwan. With an impressive portfolio of 30 patents, Lin has made significant contributions to the field of semiconductor packaging, demonstrating a strong commitment to innovation and excellence in his work.

Latest Patents

Among Lin's latest patents are two notable inventions. The first is a "Semiconductor package with dummy MIM capacitor die," which includes at least one functional die and a dummy die free of an active circuit. This dummy die integrates a metal-insulator-metal (MIM) capacitor, connected through a redistribution layer (RDL) structure to the functional die. The second patent, titled "Semiconductor package structure having an annular frame with truncated corners," describes a unique substrate design that houses multiple semiconductor dies arranged side-by-side, enveloped by molding material, with an annular frame providing additional structural support.

Career Highlights

Yi-Jou Lin has worked with industry leaders such as MediaTek Corporation and Taiwan Semiconductor Manufacturing Company Ltd., where he has honed his skills and contributed to the advancement of semiconductor technologies. His expertise and innovative approach to semiconductor packaging have significantly influenced the industry.

Collaborations

Throughout his career, Lin has collaborated with talented colleagues, including I-Hsuan Peng and Shuo-Mao Chen. Together, they have pushed the boundaries of what is possible within the semiconductor sector, resulting in groundbreaking inventions and patents.

Conclusion

Yi-Jou Lin is a notable figure in the field of semiconductor packaging, with a robust record of patents that reflect his inventive spirit. His work continues to inspire future innovations in the industry, making a lasting impact on the technological landscape.