Yi-Fu Chung

Title: Yi-Fu Chung: Innovator in Semiconductor Technology

Introduction

Yi-Fu Chung is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His innovative approaches have led to advancements in wafer reclamation and power device fabrication.

Latest Patents

One of Yi-Fu Chung's latest patents is a method for reclaiming and reusing wafers. This invention provides a systematic approach to improve the quality of the deposition process of polysilicon layers on productive wafers. The method involves oxidizing parts of the polysilicon layer and removing oxide layers to enhance the usability of nonproductive wafers. Another notable patent is related to the fabrication of trench power devices. This method focuses on reducing Miller capacitance and RC delay by forming an oxide layer at the bottom of the trench, which is crucial for the performance of electronic devices.

Career Highlights

Throughout his career, Yi-Fu Chung has worked with notable companies such as Mosel Vitelic Corporation and Mosel Vitelec, Inc. His experience in these organizations has allowed him to refine his skills and contribute to significant technological advancements in the semiconductor industry.

Collaborations

Yi-Fu Chung has collaborated with talented individuals in his field, including Jen-Chieh Chang and Shih-Chi Lai. These collaborations have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Yi-Fu Chung's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in wafer reclamation and power device fabrication.