The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2004

Filed:

Jun. 02, 2003
Applicant:
Inventors:

Shih-Chi Lai, Hsinchu, TW;

Yi-Fu Chung, Hsinchu, TW;

Jen-Chieh Chang, Hsinchu, TW;

Ching-Chiu Chu, Hsinchu, TW;

Assignee:

Mosel Vitelic, Inc., Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/176 ; H01L 2/1302 ; H01L 2/1461 ;
U.S. Cl.
CPC ...
H01L 2/176 ; H01L 2/1302 ; H01L 2/1461 ;
Abstract

Embodiments of the present invention are directed to a method of forming a bottom oxide layer in a trench on a semiconductor substrate. In one embodiment, a method for forming a bottom oxide layer in a trench on a semiconductor substrate comprises depositing an oxide layer along the surface of the sidewall and the bottom of a trench on a semiconductor substrate which has top layers, depositing a nitride layer along the surface of the said oxide layer, and forming a photo-resist filler in a trench. The top surface of the photo-resist filler is lower than the top surface of the substrate to expose a portion of the nitride layer uncovered by the photo-resist filler. The exposed portion of the nitride layer is removed to expose the oxide layer underneath. A portion of the oxide layer on the sidewalls of a trench is removed to form a bottom oxide layer in a trench.


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