Yi Elyn Xu

Title: The Innovative Contributions of Yi Elyn Xu

Introduction

Yi Elyn Xu is a prominent inventor based in Folsom, California. He has made significant contributions to the field of technology, particularly in the area of semiconductor packaging. With a total of 15 patents to his name, Xu's work has had a substantial impact on improving the reliability and efficiency of interconnect structures.

Latest Patents

Among his latest patents is a design for thermal fatigue resistance and interconnect joint reliability. This invention provides techniques for forming an interconnect structure that includes micro features, which enhance the reliability of interconnect joints compared to conventional pads. The interconnect structure comprises a metal pad over a substrate, such as a semiconductor package or PCB. The micro features increase the contact area between solder and the metal pad, improving adherence and the joint's ability to absorb stress from substrates with differing thermal expansion coefficients. Another notable patent is the multi-die, vertical-wire package-in-package apparatus. This invention includes at least two memory-die stacks that are vertically stacked on a bond-wire board, enhancing the efficiency of memory modules.

Career Highlights

Yi Elyn Xu is currently employed at Intel Corporation, where he continues to innovate and develop new technologies. His work at Intel has positioned him as a key player in advancing semiconductor technology.

Collaborations

Xu has collaborated with notable coworkers, including Florence R Pon and Hyoung Il Kim, contributing to various projects that enhance the capabilities of semiconductor devices.

Conclusion

Yi Elyn Xu's contributions to the field of semiconductor technology through his innovative patents demonstrate his expertise and commitment to advancing the industry. His work not only improves interconnect reliability but also paves the way for future advancements in technology.