logo

For the Inventor, By the Inventor

Hsinchu, Taiwan

Yi-Ching Liu

This inventor holds 76 USPTO granted patents and 39 published patent applications, primarily in 3D Memory Technology. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Macronix International Co., Ltd., Skymedi Corporation. Active years: 2006-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yi-Ching Liu. Retrieved from https://idiyas.com/inventor/yi-ching-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 76 

% Patents Active = 100.0

Average Co-Inventor Count = 3.9

ph-index = 5

Forward Citations = 101(Granted Patents)

Forward Citations (Not Self Cited) = 63(Dec 10, 2025)


Location History:

  • Hsinchu, CN (2006)
  • New Taipei, TW (2021 - 2022)
  • Hsinchu, TW (2009 - 2024)

Company Filing History:

goldMedal60 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal11 out of 3,609 
 
Macronix International Co., Ltd.
 patents
bronzeMedal2 out of 56 
 
Skymedi Corporation
 patents
4. 1 out of 1 
 
Macroniz Interntaional Co., Ltd.
 patent
5. 1 out of 15 
 
Magic Control Technology Corporation
 patents
6. 1 out of 491 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2006-2026

Loading Chart...
Areas of Expertise:
3D Memory
Ferroelectric Memory
SRAM Cell
DRAM Circuit
Memory Systems
Compute-In-Memory
Semiconductor Devices
Capacitive Loading
Memory Array
Integrated Circuit
Memory Structures
NAND Architecture
76 patents (USPTO):Explore Patents
1. 12761874 - Compute-in-memory systems and methods with configurable input and summing units (2026-10-13),
2. 12718854 - Reducing capacitive loading of memory system based on switches (2026-08-25),
3. 12694915 - Memory device (2026-07-28),
4. 12677423 - Compute-in-memory device and method (2026-07-07),
5. 12676181 - Memory circuits, memory structures, and methods for fabricating a memory device (2026-07-07),
6. 12670959 - Three-dimensional one time programmable memory (2026-06-30),
7. 12562216 - Circuit with swept voltage on bit line or bit line bar (2026-02-24),
8. 12543322 - Ferroelectric memory device with carrier structures (2026-02-03),
9. 12463113 - Memory structure having novel circuit routing and method for manufacturing the same (2025-11-04),
10. 12462860 - Using split word lines and switches for reducing capacitive loading on a memory system (2025-11-04),
11. 12426231 - Structures of sram cell and methods of fabricating the same (2025-09-23),
12. 12406702 - Switches to reduce routing rails of memory system (2025-09-02),
13. 12402322 - Common-connection method in 3D memory (2025-08-26),
14. 12394469 - DRAM computation circuit and method (2025-08-19),
15. 12388065 - Memory circuits (2025-08-12),

Title: The Innovative Journey of Yi-Ching Liu

Introduction: Yi-Ching Liu is a pioneering inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Yi-Ching Liu holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Yi-Ching Liu has worked with leading tech companies in Taiwan, spearheading research and development projects that have led to significant advancements in various industries.

Collaborations: Throughout his career, Yi-Ching Liu has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing.

Conclusion: Yi-Ching Liu's passion for innovation, coupled with his relentless drive to push the boundaries of technology, has solidified his reputation as a visionary inventor in the global innovation landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…