Yew Wee Cheong

Title: Yew Wee Cheong: Innovator in Semiconductor Packaging

Introduction

Yew Wee Cheong is a prominent inventor based in Penang, Malaysia. He has made significant contributions to the field of semiconductor packaging, holding a total of 6 patents. His innovative techniques have advanced the efficiency and effectiveness of packaging methods in the electronics industry.

Latest Patents

One of Yew Wee Cheong's latest patents is focused on die molding for flip chip molded matrix array packages using UV curable tape. This invention involves a technique to package flip chip molded matrix array packages by laminating an ultraviolet (UV) curable tape on the die backside of a strip of array flip chips. The process includes molding the strip with a mold film and irradiating it using UV radiation. Another notable patent describes a wafer grinding method that outlines techniques for grinding low-K interlayer dielectric (ILD) wafers. This method allows for cutting and severing a semiconductor wafer while maintaining the proximity of the portions, ensuring they remain held together by adhesive.

Career Highlights

Yew Wee Cheong is currently employed at Intel Corporation, where he continues to innovate and develop new technologies in semiconductor packaging. His work has been instrumental in enhancing the performance and reliability of electronic devices.

Collaborations

Throughout his career, Yew Wee Cheong has collaborated with notable colleagues, including Weng Khoon Mong and Oi Fong Chin. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Yew Wee Cheong's contributions to semiconductor packaging through his innovative patents and collaborations highlight his role as a key figure in the electronics industry. His work continues to influence advancements in technology and improve manufacturing processes.