The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2007
Filed:
Aug. 25, 2004
AL Ling Low, Kedah, MY;
Yee Hao Ho, Taman Sri Angsana, MY;
Yew Wee Cheong, Penang, MY;
Wei Keat Loh, Penang, MY;
Al Ling Low, Kedah, MY;
Yee Hao Ho, Taman Sri Angsana, MY;
Yew Wee Cheong, Penang, MY;
Wei Keat Loh, Penang, MY;
Intel Corporation, Santa Clara, CA (US);
Abstract
An apparatus having and method of forming grooves in the surface of a substrate adjacent and parallel to sidewall locations for circuit chips or die mounted on the surface. The grooves have physical dimensions to retain fill material formed between the packages and the surface of the substrate so that the fill material does not bridge between chips, thus reducing warping of the substrate due to mismatches in coefficient of thermal expansion (CTE) between the fill material, the substrate, the chips, and mold material formed over the substrate, under fill, and chips.