Company Filing History:
Years Active: 2007
Title: Innovations of Yee Hao Ho
Yee Hao Ho is an accomplished inventor based in Taman Sri Angsana, Malaysia. He has made significant contributions to the field of technology, particularly in the area of substrate design for electronic components. His innovative approach has led to the development of a unique patent that addresses common challenges in the industry.
Latest Patents
Yee Hao Ho holds a patent for "Substrate grooves to reduce underfill fillet bridging." This invention involves an apparatus and method for forming grooves in the surface of a substrate adjacent and parallel to sidewall locations for circuit chips or die mounted on the surface. The grooves are designed with specific physical dimensions to retain fill material formed between the packages and the surface of the substrate. This design prevents the fill material from bridging between chips, thereby reducing warping of the substrate due to mismatches in the coefficient of thermal expansion (CTE) between the fill material, the substrate, the chips, and the mold material formed over the substrate, underfill, and chips. Yee Hao Ho's patent represents a significant advancement in substrate technology.
Career Highlights
Yee Hao Ho is currently employed at Intel Corporation, a leading technology company known for its innovations in semiconductor manufacturing. His work at Intel has allowed him to apply his inventive skills in a collaborative environment, contributing to the development of cutting-edge technologies.
Collaborations
Yee Hao Ho has worked alongside talented colleagues, including Al Ling Low and Yew Wee Cheong. Their collaboration has fostered a creative atmosphere that encourages innovation and the sharing of ideas.
Conclusion
Yee Hao Ho's contributions to the field of substrate technology exemplify the spirit of innovation. His patent not only addresses critical industry challenges but also showcases his dedication to advancing technology. His work at Intel Corporation and collaborations with fellow inventors further highlight his impact on the field.