Company Filing History:
Years Active: 2007
Title: Al Ling Low - Innovator in Substrate Technology
Introduction
Al Ling Low is a notable inventor based in Kedah, Malaysia. He has made significant contributions to the field of substrate technology, particularly in the area of underfill materials used in electronic packaging. His innovative approach addresses critical challenges faced in the manufacturing of circuit chips.
Latest Patents
Al Ling Low holds a patent for "Substrate grooves to reduce underfill fillet bridging." This invention involves an apparatus and method for forming grooves in the surface of a substrate adjacent and parallel to the sidewall locations for circuit chips or die mounted on the surface. The grooves are designed with specific physical dimensions to retain fill material between the packages and the substrate surface. This design prevents the fill material from bridging between chips, thereby reducing warping of the substrate due to mismatches in the coefficient of thermal expansion (CTE) among the fill material, substrate, chips, and mold material.
Career Highlights
Al Ling Low is currently employed at Intel Corporation, where he continues to develop innovative solutions in the field of electronics. His work has been instrumental in enhancing the reliability and performance of electronic devices.
Collaborations
Some of his coworkers include Yee Hao Ho and Yew Wee Cheong, who collaborate with him on various projects within the company.
Conclusion
Al Ling Low's contributions to substrate technology exemplify the importance of innovation in the electronics industry. His patent addresses significant challenges and showcases his commitment to advancing technology in this field.