The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2006
Filed:
Oct. 27, 2003
Applicants:
Oi Fong Chin, Butterworth, MY;
Yew Wee Cheong, Penang, MY;
Weng Khoon Mong, Penang, MY;
Inventors:
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/301 (2006.01);
U.S. Cl.
CPC ...
Abstract
Methods and apparatus for separating dice from a substrate are described herein.
Chin, Oi. (2006). Controlled fracture substrate singulation (U.S. Patent No. 7005317). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7005317
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile