Company Filing History:
Years Active: 2004-2016
Title: Weng Khoon Mong: Innovator in Electronic Substrate Technology
Introduction
Weng Khoon Mong is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of electronic substrates, holding a total of 6 patents. His work focuses on advanced assembly processes that enhance the performance and efficiency of electronic devices.
Latest Patents
Weng Khoon Mong's latest patents include a flip chip assembly process for ultra-thin substrates and package-on-package assembly. In some embodiments, selective electroless plating for electronic substrates is presented. A method is introduced that includes receiving a coreless substrate strip, attaching solder balls to the backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed, showcasing his innovative approach to electronic assembly.
Career Highlights
Weng Khoon Mong is currently employed at Intel Corporation, where he continues to push the boundaries of technology in electronic substrates. His expertise and innovative mindset have made him a valuable asset to the company.
Collaborations
Weng Khoon Mong collaborates with talented individuals such as Mun Leong Loke and Yew Wee Cheong, who contribute to his projects and enhance the overall innovation process.
Conclusion
Weng Khoon Mong's contributions to electronic substrate technology through his patents and work at Intel Corporation highlight his role as a leading inventor in the field. His innovative methods are paving the way for advancements in electronic assembly processes.