The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2016
Filed:
Sep. 29, 2014
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Weng Khoon Mong, Penang, MY;
A. Vethanayagam Rudge, Penang, MY;
Bok Sim Lim, Penang, MY;
Mun Leong Loke, Biekit Mertajam, MY;
Kang Eu Ong, Penang, MY;
Sih Fei Lim, Bukit Mertajasu, MY;
Tean Wee Ong, Penang, MY;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/12 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01); H01L 23/50 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/12 (2013.01); H01L 23/3157 (2013.01); H01L 23/49816 (2013.01); H01L 23/50 (2013.01); H01L 23/562 (2013.01); H01L 24/17 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 23/3128 (2013.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15165 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3511 (2013.01);
Abstract
In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.