Location History:
- Penang, MY (2012 - 2014)
- Bukit Mertajasu, MY (2016)
Company Filing History:
Years Active: 2012-2016
Title: Sih Fei Lim: Innovator in Electronic Substrate Technologies
Introduction
Sih Fei Lim is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of electronic substrates, holding a total of 3 patents. His work focuses on advanced assembly processes that enhance the performance and efficiency of electronic devices.
Latest Patents
One of Sih Fei Lim's latest patents is a flip chip assembly process for ultra-thin substrates and package-on-package assembly. This innovation includes selective electroless plating for electronic substrates. The method involves receiving a coreless substrate strip, attaching solder balls to the backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments of this technology are also disclosed and claimed.
Career Highlights
Sih Fei Lim is currently employed at Intel Corporation, where he continues to develop cutting-edge technologies in electronic assembly. His expertise in the field has positioned him as a key player in advancing substrate technology.
Collaborations
Throughout his career, Sih Fei Lim has collaborated with talented individuals such as Weng Khoon Mong and A Vethanayagam Rudge. These partnerships have fostered innovation and contributed to the success of various projects.
Conclusion
Sih Fei Lim's contributions to electronic substrate technologies through his patents and work at Intel Corporation highlight his role as an influential inventor in the industry. His innovative approaches continue to shape the future of electronic assembly processes.