Growing community of inventors

Penang, Malaysia

Sih Fei Lim

Average Co-Inventor Count = 7.00

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 2

Sih Fei LimMun Leong Loke (3 patents)Sih Fei LimWeng Khoon Mong (3 patents)Sih Fei LimKang Eu Ong (3 patents)Sih Fei LimBok Sim Lim (3 patents)Sih Fei LimA Vethanayagam Rudge (3 patents)Sih Fei LimTean Wee Ong (2 patents)Sih Fei LimTean Wee One (1 patent)Sih Fei LimSih Fei Lim (3 patents)Mun Leong LokeMun Leong Loke (7 patents)Weng Khoon MongWeng Khoon Mong (6 patents)Kang Eu OngKang Eu Ong (4 patents)Bok Sim LimBok Sim Lim (3 patents)A Vethanayagam RudgeA Vethanayagam Rudge (3 patents)Tean Wee OngTean Wee Ong (2 patents)Tean Wee OneTean Wee One (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Intel Corporation (3 from 54,905 patents)


3 patents:

1. 9397016 - Flip chip assembly process for ultra thin substrate and package on package assembly

2. 8847368 - Flip chip assembly process for ultra thin substrate and package on package assembly

3. 8258019 - Flip chip assembly process for ultra thin substrate and package on package assembly

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as of
1/20/2026
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