The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2012

Filed:

Jun. 30, 2008
Applicants:

Weng Khoon Mong, Penang, MY;

A. Vethanayagam Rudge, Penang, MY;

Bok Sim Lim, Penang, MY;

Mun Leong Loke, Penang, MY;

Kang Eu Ong, Penang, MY;

Sih Fei Lim, Penang, MY;

Tean Wee Ong, Penang, MY;

Inventors:

Weng Khoon Mong, Penang, MY;

A. Vethanayagam Rudge, Penang, MY;

Bok Sim Lim, Penang, MY;

Mun Leong Loke, Penang, MY;

Kang Eu Ong, Penang, MY;

Sih Fei Lim, Penang, MY;

Tean Wee Ong, Penang, MY;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.


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