This inventor holds 4 USPTO granted patents and 4 published patent applications. Top assignee: Intel Corporation. Active years: 2012-2020.
Company Filing History:
Years Active: 2012-2020
Title: Innovations of Kang Eu Ong
Introduction
Kang Eu Ong is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of integrated circuit packaging, holding a total of 4 patents. His work primarily focuses on enhancing the efficiency and functionality of electronic components.
Latest Patents
Kang Eu Ong's latest patents include a lower IC package structure designed for coupling with an upper IC package to form a package-on-package (PoP) assembly. This innovative lower IC package structure features an interposer with pads that mate with the terminals of an upper IC package. An encapsulant material is strategically placed within the lower IC package, often positioned near one or more IC dies. This assembly can be integrated into a mainboard or other circuit boards, contributing to the overall functionality of computing systems. Another significant patent involves a flip chip assembly process for ultra-thin substrates and package-on-package assembly. This method introduces selective electroless plating for electronic substrates, detailing a process that includes receiving a coreless substrate strip, attaching solder balls to its backside, and forming a backside stiffening mold among the solder balls.
Career Highlights
Kang Eu Ong is currently employed at Intel Corporation, where he continues to innovate and develop advanced technologies in the field of electronics. His expertise in integrated circuit packaging has positioned him as a valuable asset to the company.
Collaborations
Throughout his career, Kang has collaborated with notable colleagues, including Weng Khoon Mong and A Vethanayagam Rudge. These collaborations have further enhanced his contributions to the field.
Conclusion
Kang Eu Ong's work in integrated circuit packaging exemplifies innovation and dedication to advancing technology. His patents reflect a commitment to improving electronic systems, making him a significant figure in the industry.