Company Filing History:
Years Active: 2012-2016
Title: The Innovations of Bok Sim Lim
Introduction
Bok Sim Lim is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of electronic substrates, holding a total of 3 patents. His work focuses on advanced assembly processes that enhance the performance and efficiency of electronic devices.
Latest Patents
Among his latest patents is a flip chip assembly process for ultra-thin substrates and package-on-package assembly. This innovation presents a method that includes receiving a coreless substrate strip, attaching solder balls to the backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments of this technology are also disclosed and claimed, showcasing the versatility and potential applications of his work.
Career Highlights
Bok Sim Lim is currently employed at Intel Corporation, where he continues to push the boundaries of technology. His expertise in selective electroless plating for electronic substrates has positioned him as a key player in the development of next-generation electronic components.
Collaborations
Throughout his career, Bok Sim Lim has collaborated with talented individuals such as Weng Khoon Mong and A Vethanayagam Rudge. These partnerships have fostered an environment of innovation and creativity, leading to groundbreaking advancements in the field.
Conclusion
Bok Sim Lim's contributions to the field of electronic substrates through his patents and collaborations highlight his role as a leading inventor. His work continues to influence the industry and pave the way for future innovations.