Growing community of inventors

Penang, Malaysia

Bok Sim Lim

Average Co-Inventor Count = 7.00

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 2

Bok Sim LimMun Leong Loke (3 patents)Bok Sim LimWeng Khoon Mong (3 patents)Bok Sim LimKang Eu Ong (3 patents)Bok Sim LimSih Fei Lim (3 patents)Bok Sim LimA Vethanayagam Rudge (3 patents)Bok Sim LimTean Wee Ong (2 patents)Bok Sim LimTean Wee One (1 patent)Bok Sim LimBok Sim Lim (3 patents)Mun Leong LokeMun Leong Loke (7 patents)Weng Khoon MongWeng Khoon Mong (6 patents)Kang Eu OngKang Eu Ong (4 patents)Sih Fei LimSih Fei Lim (3 patents)A Vethanayagam RudgeA Vethanayagam Rudge (3 patents)Tean Wee OngTean Wee Ong (2 patents)Tean Wee OneTean Wee One (1 patent)
..
Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Intel Corporation (3 from 54,858 patents)


3 patents:

1. 9397016 - Flip chip assembly process for ultra thin substrate and package on package assembly

2. 8847368 - Flip chip assembly process for ultra thin substrate and package on package assembly

3. 8258019 - Flip chip assembly process for ultra thin substrate and package on package assembly

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