Intel Corporation

Weng Khoon Mong

Mun Leong Loke

Yew Wee Cheong

Kang Eu Ong

A Vethanayagam Rudge

Sih Fei Lim

Bok Sim Lim

Tean Wee Ong

Oi Fong Chin

Eng Chiang Gan

Tean Wee One

In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.

Flip chip assembly process for ultra thin substrate and package on package assembly

An apparatus and a system for separating dice from a substrate are described herein.

Apparatus for controlled fracture substrate singulation

Methods and apparatus for separating dice from a substrate are described herein.

Controlled fracture substrate singulation

A method that includes, obtaining a substrate, placing a reinforcing layer over a first side of the substrate; and thinning the substrate by removing material from an opposite side of the substrate.

Method of thinning a wafer utilizing a laminated reinforcing layer over the device side

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Penang, Malaysia

Weng Khoon Mong