Yeon Sik Lee

Title: Innovations by Yeon Sik Lee in Wafer Manufacturing

Introduction

Yeon Sik Lee is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of wafer manufacturing, holding three patents that enhance the quality and efficiency of semiconductor materials.

Latest Patents

His latest patents include a wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby. The wafer manufacturing method enables the production of wafers with a low density of micropipe defects, minimizing the presence of particles and scratches. The epitaxial wafer manufacturing method allows for the creation of epitaxial wafers that exhibit low densities of defects such as downfall, triangular, and carrot defects. These innovations lead to excellent device characteristics and improved yield of devices. Additionally, his work on silicon carbide ingots and wafers focuses on producing wafers with relaxation moduli differing by 450 GPa or less, enhancing their mechanical properties.

Career Highlights

Yeon Sik Lee is associated with Senic Inc., where he applies his expertise in semiconductor technology. His work has been instrumental in advancing the manufacturing processes of wafers, contributing to the overall efficiency and effectiveness of semiconductor production.

Collaborations

He collaborates with notable colleagues, including Jong Hwi Park and Jung-Gyu Kim, to further innovate in the field of wafer manufacturing.

Conclusion

Yeon Sik Lee's contributions to wafer manufacturing through his innovative patents have significantly impacted the semiconductor industry. His work continues to pave the way for advancements in technology and manufacturing processes.