The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
Mar. 05, 2021
Applicant:
Senic Inc., Cheonan-si, KR;
Inventors:
Jong Hwi Park, Suwon-si, KR;
Jongmin Shim, Hwaseong-si, KR;
Eun Su Yang, Suwon-si, KR;
Yeon Sik Lee, Suwon-si, KR;
Byung Kyu Jang, Suwon-si, KR;
Jung Woo Choi, Suwon-si, KR;
Sang Ki Ko, Suwon-si, KR;
Kap-Ryeol Ku, Suwon-si, KR;
Jung-Gyu Kim, Suwon-si, KR;
Assignee:
SENIC INC., Cheonan-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 29/36 (2006.01); C30B 23/02 (2006.01); C30B 33/00 (2006.01);
U.S. Cl.
CPC ...
C30B 29/36 (2013.01); C30B 23/025 (2013.01); C30B 33/00 (2013.01);
Abstract
A wafer having relaxation moduli different by 450 GPa or less, as determined by dynamic mechanical analysis, when loaded to 1 N and 18 N with a loading rate of 0.1 N/min at a temperature of 25° C.