logo

For the Inventor, By the Inventor

Nishishirakawa, Japan

Yasuyoshi Kuroda

This inventor holds 10 USPTO granted patents. Top assignees: Shin-Etsu Handotai Co., Ltd., Fujikoshi Machinery Corp., Other. Active years: 1995-2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yasuyoshi Kuroda. Retrieved from https://idiyas.com/inventor/yasuyoshi-kuroda-47eks2i1

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10

% Patents Active = 100.0

Average Co-Inventor Count = 3.7

ph-index = 7

Forward Citations = 161(Granted Patents)


Location History:

  • Fukushima, JP (1995)
  • Nishigo-mura, Nishi-Shirakawa-gun, Fukushima-ken, JP (1995)
  • Nishi-shirakawa-gun, JP (1998 - 1999)
  • Fukushima-ken, JP (1996 - 2001)

Company Filing History:

goldMedal9 out of 1,099 
 
Shin-Etsu Handotai Co., Ltd.
 patents
silverMedal4 out of 71 
 
Fujikoshi Machinery Corp.
 patents
bronzeMedal1 out of 834,513 
Other
 patents
where one patent can have more than one assignee

Years Active: 1995-2001

Loading Chart...
10 patents (USPTO):Explore Patents
1. 6234879 - Method and apparatus for wafer chamfer polishing (2001-05-22),
2. 5928066 - Apparatus for polishing peripheral portion of wafer (1999-07-27),
3. 5882539 - Wafer processing method and equipment therefor (1999-03-16),
4. 5766065 - Apparatus for polishing peripheral portion of wafer (1998-06-16),
5. 5733181 - Apparatus for polishing the notch of a wafer (1998-03-31),
6. 5727990 - Method for mirror-polishing chamfered portion of wafer and (1998-03-17),
7. 5547415 - Method and apparatus for wafer chamfer polishing (1996-08-20),
8. 5538463 - Apparatus for bevelling wafer-edge (1996-07-23),
9. 5476413 - Apparatus for polishing the periphery portion of a wafer (1995-12-19),
10. 5404678 - Wafer chamfer polishing apparatus with rotary circular dividing table (1995-04-11),

Title: Innovations of Yasuyoshi Kuroda

Introduction

Yasuyoshi Kuroda is a prominent inventor based in Nishishirakawa-gun, Japan. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 10 patents. His work focuses on improving the efficiency and effectiveness of wafer processing techniques.

Latest Patents

Kuroda's latest patents include a "Method and apparatus for wafer chamfer polishing." This invention is designed to ensure that a semiconductor wafer remains securely held by a rotatory suction cup during the entire polishing operation. The apparatus features a circular turntable equipped with six wafer suction cups that rotate step-wise to facilitate the transfer of wafers. Another notable patent is the "Apparatus for polishing peripheral portion of wafer." This polishing apparatus includes a rotary drum with an abrasive tape, a wafer holding mechanism, and a moving member that adjusts the tilt angle of the wafer for optimal contact with the abrasive surface.

Career Highlights

Throughout his career, Yasuyoshi Kuroda has worked with notable companies such as Shin-Etsu Handotai Co., Ltd. and Fujikoshi Machinery Corporation. His experience in these organizations has allowed him to develop innovative solutions that address the challenges faced in semiconductor manufacturing.

Collaborations

Kuroda has collaborated with several professionals in his field, including Fumihiko Hasegawa and Tatsuo Ohtani. These collaborations have contributed to the advancement of technology in wafer processing.

Conclusion

Yasuyoshi Kuroda's contributions to the semiconductor industry through his patents and collaborations highlight his role as an influential inventor. His innovative approaches continue to shape the future of wafer processing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…