The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 1998
Filed:
Jan. 06, 1997
Applicant:
Inventors:
Fumihiko Hasegawa, Nishi-shirakawa-gun, JP;
Tatsuo Ohtani, Nishi-shirakawa-gun, JP;
Yasuyoshi Kuroda, Nishi-shirakawa-gun, JP;
Koichiro Ichikawa, Nagano, JP;
Yasuo Inada, Nagano, JP;
Assignees:
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Fujikoshi Machinery Corp., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B / ; B24B / ; B24B / ;
U.S. Cl.
CPC ...
451 44 ; 451 57 ; 451 65 ; 451221 ; 451254 ;
Abstract
A method and an apparatus, which enable mirror-polishing a peripheral chamfered portion of a semiconductor wafer effectively, are disclosed. Mirror-polishing a peripheral side surface of the chamfered portion of the wafer, beveled surfaces thereof, and rounded edges formed between the peripheral side surface and each of the beveled surfaces, are individually carried out.