Urawa, Japan

Fumihiko Hasegawa

This inventor holds 27 USPTO granted patents, primarily in Wafer Polishing Technology. Top assignees: Shin-Etsu Handotai Co., Ltd., Fujikoshi Machinery Corp., Other. Active years: 1992-2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fumihiko Hasegawa. Retrieved from https://idiyas.com/inventor/fumihiko-hasegawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 13

Forward Citations = 429(Granted Patents)


Location History:

  • Saitama, JP (1993 - 1994)
  • Urawa-shi, Saitame-ken, JP (1995)
  • Fukushima-ken, JP (1996 - 1999)
  • Nishishirakawa-gun, JP (1997 - 1999)
  • Nishishirakawa, JP (1999)
  • Fukushima, JP (1995 - 2000)
  • Urawa, JP (1992 - 2001)
  • Nishigou-mura, JP (1999 - 2001)

Company Filing History:


Years Active: 1992-2001

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Areas of Expertise:
Wafer Polishing
Chamfer Polishing
Wafer Processing
Thin Plate Polishing
Bevelling
Czochralski Crystals
Automatic Transfer
Lapping Apparatus
Notch Polishing
Scrubber Apparatus
27 patents (USPTO):Explore Patents

Title: Fumihiko Hasegawa: Innovator in Semiconductor Wafer Polishing

Introduction

Fumihiko Hasegawa, an accomplished inventor from Urawa, Japan, has made significant contributions to the field of semiconductor manufacturing through his innovative methods and technologies. With an impressive portfolio of 27 patents, Hasegawa's work focuses primarily on improving the efficiency and precision of wafer polishing processes.

Latest Patents

Among Hasegawa's latest inventions are two notable patents addressing wafer chamfer polishing techniques. The first patent, titled "Method of and apparatus for mirror-like polishing wafer chamfer with orientation flat," discloses a novel approach to achieving a mirror-surface finish on wafer chamfers. This method utilizes a rotating buffering wheel to apply pressure while the wafer is securely rotated, allowing for high response and accuracy in rotational speed control. The second patent, "Method and apparatus for wafer chamfer polishing," describes an apparatus designed to retain the wafer in a suction cup during the entire polishing operation. This innovation features a circular turntable equipped with six suction cups, systematically turning to transfer the wafers through the polishing process.

Career Highlights

Throughout his career, Hasegawa has collaborated with leading companies in the semiconductor industry, including Shin-Etsu Handotai Co., Ltd. and Fujikoshi Machinery Corporation. His expertise in wafer polishing technologies has had a profound impact on manufacturing practices, enhancing the quality and reliability of semiconductor wafers.

Collaborations

Hasegawa has worked alongside notable colleagues, including Tatsuo Ohtani and Yasuyoshi Kuroda, who have also contributed to advancements in semiconductor manufacturing. Their collaborative efforts exemplify the importance of teamwork in driving innovation within the industry.

Conclusion

Fumihiko Hasegawa's dedication to improving wafer polishing techniques has significantly advanced the semiconductor manufacturing process. His 27 patents reflect a commitment to innovation, positioning him as a key figure in the field. Through his inventive work and collaboration with esteemed colleagues, Hasegawa continues to shape the future of semiconductor technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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