The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 1998
Filed:
Dec. 05, 1995
Fumihiko Hasegawa, Nishi-shirakawa-gun, JP;
Yasuyoshi Kuroda, Nishi-shirakawa-gun, JP;
Koichiro Ichikawa, Nagano, JP;
Yasuo Inada, Nagano, JP;
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Fujikoshi Machinery Corp., Nagano, JP;
Abstract
A polishing apparatus of a peripheral chamfered portion of a semiconductor wafer is disclosed. The polishing apparatus comprises: a rotary drum around the periphery of which a tape having an abrasive layer thereon is wound; a first motor for rotating the rotary drum; a wafer holding mechanism which comprises a wafer holding member for holding a wafer, a second motor for rotating the wafer holding member, a supporting member for supporting the wafer holding member and the second motor, and a wafer inclining member for changing the tilt angle of the wafer with respect to the rotary drum by reciprocally rotating the supporting member on a first axis which is substantially parallel with the main surface of the wafer; and a moving member for bringing the wafer held on the supporting member into contact with or separating it from the tape wound around the rotary drum.