Kanagawa-ken, Japan

Yasuhiro Koshio


Average Co-Inventor Count = 2.4

ph-index = 4

Forward Citations = 82(Granted Patents)


Location History:

  • Oita, JP (2013 - 2015)
  • Kawasaki, JP (2001 - 2016)
  • Kanagawa-ken, JP (2002 - 2017)

Company Filing History:


Years Active: 2001-2017

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10 patents (USPTO):

Title: Yasuhiro Koshio: Innovator in Semiconductor Technology

Introduction

Yasuhiro Koshio is a prominent inventor based in Kanagawa-ken, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His work has been instrumental in advancing mobile device technology and semiconductor packaging.

Latest Patents

One of Koshio's latest patents involves a semiconductor package and mobile device utilizing the same technology. According to the patent, the semiconductor package includes a semiconductor chip mounted on an interposer board, an encapsulant sealing the semiconductor chip, and a conductive shielding layer covering the encapsulant and at least part of a side surface of the interposer board. The interposer board features multiple vias through an insulating substrate, with some vias having a cutting plane that exposes the side surface of the interposer board and is cut in the thickness direction. This innovative design allows for electrical connection between the cutting plane of the via and the conductive shielding layer.

Career Highlights

Yasuhiro Koshio is associated with Kabushiki Kaisha Toshiba, a leading company in the technology sector. His work at Toshiba has allowed him to explore and develop cutting-edge semiconductor technologies that have applications in various electronic devices.

Collaborations

Koshio has collaborated with notable colleagues in his field, including Masatoshi Fukuda and Mitsuru Oida. These collaborations have fostered innovation and have contributed to the successful development of new technologies.

Conclusion

Yasuhiro Koshio's contributions to semiconductor technology and his innovative patents highlight his role as a key figure in the industry. His work continues to influence the development of mobile devices and semiconductor packaging solutions.

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