The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2013
Filed:
Sep. 15, 2010
Hideo Aoki, Yokohama, JP;
Masatoshi Fukuda, Yokohama, JP;
Kanako Sawada, Yokohama, JP;
Yasuhiro Koshio, Oita, JP;
Hideo Aoki, Yokohama, JP;
Masatoshi Fukuda, Yokohama, JP;
Kanako Sawada, Yokohama, JP;
Yasuhiro Koshio, Oita, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
According to a manufacturing method of one embodiment, a first solder bump and a second solder bump are aligned and placed in contact with each other, and thereafter, the first and second solder bumps are heated to a temperature equal or higher than a melting point of the solder bumps and melted, whereby a partially connection body of the first solder bump and the second solder bump is formed. The partially connection body is cooled. The cooled partially connection body is heated to a temperature equal to or higher than the melting point of the solder bump in a reducing atmosphere, thereby to form a permanent connection body by melting the partially connection body while removing an oxide film existing on a surface of the partially connection body.