Yasuhiko Yamamoto

Title: Yasuhiko Yamamoto: Innovator in Semiconductor Technology

Introduction

Yasuhiko Yamamoto is a prominent inventor based in Ibaraki, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on innovative methods and materials that enhance the manufacturing processes of semiconductor devices.

Latest Patents

Yamamoto's latest patents include a laminated sheet designed for adhering to the circuit side of a projected electrode-mounting wafer during the grinding process of the wafer's backside. This laminated sheet consists of multiple layers, including a thermosetting resin layer, a thermoplastic resin layer, and an outermost layer made of a thermoplastic resin that remains non-plastic at temperatures above 25°C. Additionally, he has developed a method for manufacturing semiconductor devices that involves grinding the backside of a wafer with the laminated sheet adhered to it, followed by the removal of other layers and cutting the wafer into individual chips. Another notable patent involves a series of semiconductor devices that include multiple semiconductor elements and electrically conductive parts, all sealed within a resin on a removable substrate.

Career Highlights

Yasuhiko Yamamoto is associated with Nitto Denko Corporation, where he has been instrumental in advancing semiconductor technologies. His innovative approaches have led to improved manufacturing techniques that benefit the industry.

Collaborations

Yamamoto has collaborated with notable colleagues, including Isao Ohki and Junji Yoshida, contributing to various projects that enhance semiconductor device manufacturing.

Conclusion

Yasuhiko Yamamoto's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in manufacturing processes and materials used in semiconductor devices.