The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 1992
Filed:
Jul. 17, 1990
Applicant:
Inventors:
Syuuji Nishimori, Osaka, JP;
Tadaaki Harada, Osaka, JP;
Yasuhiko Yamamoto, Osaka, JP;
Nobuyuki Hiromori, Osaka, JP;
Yasumori Yoshimura, Osaka, JP;
Katsuya Muramatsu, Osaka, JP;
Katsumi Shimada, Osaka, JP;
Assignee:
Nitto Denko Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 72 ; 357 70 ; 174 522 ; 525 31 ; 525481 ;
Abstract
A photosemiconductor device and an epoxy resin composition for use in molding a photosemiconductor used for the photosemiconductor device, the photosemiconductor device comprises a photosemiconductor element molded with a cured transparent epoxy resin composition, the cured transparent epoxy resin composition having a refractive index distribution curve characterized by the following (A), (B), and (C):