Nitto-denko Corporation

Yasuhiko Yamamoto

Masayuki Yamamoto

Hirofumi Fujii

Kazuhito Hosokawa

Junji Yoshida

Hiroshi Noro

Kazuo Ouchi

Takuji Okeyui

Koji Akazawa

Katsumi Shimada

Masayuki Kaneto

Tadaaki Harada

Hideo Yamashita

Isao Ohki

Syuuji Nishimori

Nobuyuki Hiromori

Yasumori Yoshimura

Katsuya Muramatsu

A laminated sheet for adhering to a circuit side of a projected electrode-mounting wafer in a step of grinding a backside of the wafer, wherein the laminated sheet comprises at least a layer (layer A) contacting with the circuit side, made of a thermosetting resin, a layer (layer B) directly laminated on the layer A, made of a thermoplastic resin having a tensile modulus of from 1 to 300 MPa at 40&#xb0; to 80&#xb0; C., and an outermost layer (layer C) made of a thermoplastic resin which is non-plastic at a temperature of at least 25&#xb0; C.; A method for manufacturing a semiconductor device, comprising the steps of grinding a backside of a projected electrode-mounting wafer wherein the laminated sheet is adhered to a circuit side of the wafer, removing other layers besides the layer A of the laminated sheet, and cutting the wafer into individual chips; and a semiconductor device obtainable by the method.

Laminated sheet

A series of semiconductor devices includes: (i) a plurality of semiconductor elements having electrodes; (ii) a plurality of electrically conductive parts formed around and electrically connected to each of the semiconductor elements; and (iii) a sealing resin in which the plurality of semiconductor elements and the plurality of electrically conductive parts are sealed and an electrode-free side of each semiconductor element and an unwired side of each electrically conductive part are formed on a single flat surface of a removable substrate.

Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device

A connecting method comprising laminating a flexible circuit substrate having a plurality of bump contacts with a contact object having a plurality of portions to be contacted such that the respective bump contacts face to the portions to be contacted at a joined surface, correspondingly each other to form a laminate, and applying pressure to the entire surface of the laminate in a compressing direction with pressurizing means provided so as to pinch the laminate in a laminating direction to contact the plural bump contacts mounted on the flexible circuit substrate with the plural portions to be contacted corresponding thereto mounted on the contact object, respectively.

Methods for connecting flexible circuit substrates to contact objects

A photosemiconductor device and an epoxy resin composition for use in molding a photosemiconductor used for the photosemiconductor device, the photosemiconductor device comprises a photosemiconductor element molded with a cured transparent epoxy resin composition, the cured transparent epoxy resin composition having a refractive index distribution curve characterized by the following (A), (B), and (C):

Photosemiconductor device and epoxy resin composition for use in molding

Growing community of inventors

Ibaraki, Japan

Yasuhiko Yamamoto