The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2007

Filed:

Jan. 10, 2005
Applicants:

Kazuhito Hosokawa, Ibaraki, JP;

Takuji Okeyui, Ibaraki, JP;

Hirofumi Fujii, Ibaraki, JP;

Yasuhiko Yamamoto, Ibaraki, JP;

Inventors:

Kazuhito Hosokawa, Ibaraki, JP;

Takuji Okeyui, Ibaraki, JP;

Hirofumi Fujii, Ibaraki, JP;

Yasuhiko Yamamoto, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A series of semiconductor devices includes: (i) a plurality of semiconductor elements having electrodes; (ii) a plurality of electrically conductive parts formed around and electrically connected to each of the semiconductor elements; and (iii) a sealing resin in which the plurality of semiconductor elements and the plurality of electrically conductive parts are sealed and an electrode-free side of each semiconductor element and an unwired side of each electrically conductive part are formed on a single flat surface of a removable substrate.


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