Yang-Tung Fan

This inventor holds 23 USPTO granted patents, primarily in Microelectronic Fabrication. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2001-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yang-Tung Fan. Retrieved from https://idiyas.com/inventor/yang-tung-fan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23

% Patents Active = 91.3

Average Co-Inventor Count = 5.2

ph-index = 14

Forward Citations = 854(Granted Patents)

Location History:

Chu-Pei, TW (2001)
Shin-chu, TW (2001 - 2002)
Juebi, TW (2004)
Jubei, TW (2002 - 2009)
Hsin-Chu, TW (2001 - 2010)

Company Filing History:

23 out of 42,810

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2001-2010

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Areas of Expertise:

Microelectronic

Color Filter

Bumping Technology

Image Sensor

Photoresist

Solder Bump

Corrosion Inhibition

Optoelectronic

Light Collection

Bond Pad

23 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7816169 - Colors only process to reduce package yield loss (2010-10-19),

2. 7485906 - Colors only process to reduce package yield loss (2009-02-03),

3. 7183598 - Colors only process to reduce package yield loss (2007-02-27),

4. 6956292 - Bumping process to increase bump height and to create a more robust bump structure (2005-10-18),

5. 6936923 - Method to form very a fine pitch solder bump using methods of electroplating (2005-08-30),

6. 6876049 - Colors only process to reduce package yield loss (2005-04-05),

7. 6765277 - Microelectronic fabrication with corrosion inhibited bond pad (2004-07-20),

8. 6649507 - Dual layer photoresist method for fabricating a mushroom bumping plating structure (2003-11-18),

9. 6632700 - Method to form a color image sensor cell while protecting the bonding pad structure from damage (2003-10-14),

10. 6605524 - Bumping process to increase bump height and to create a more robust bump structure (2003-08-12),

11. 6586323 - Method for dual-layer polyimide processing on bumping technology (2003-07-01),

12. 6583039 - Method of forming a bump on a copper pad (2003-06-24),

13. 6495813 - Multi-microlens design for semiconductor imaging devices to increase light collection efficiency in the color filter process (2002-12-17),

14. 6486054 - Method to achieve robust solder bump height (2002-11-26),

15. 6482669 - Colors only process to reduce package yield loss (2002-11-19),

Title: The Innovative Contributions of Yang-Tung Fan in Microelectronic Fabrication

Introduction: Yang-Tung Fan, an accomplished inventor based in Jubei, Taiwan, has made significant strides in the field of microelectronics, holding a total of 23 patents to his name. His innovative ideas have reshaped the way imaging devices are designed and manufactured, leading to improved efficiency and performance.

Latest Patents: One of Yang-Tung Fan's latest patents, "Colors Only Process to Reduce Package Yield Loss," outlines an advanced microelectronic fabrication sequence. This groundbreaking process involves the formation of color filters through conformal deposition directly onto a photodetector array of various imaging devices such as CCD, CID, and CMOS. The innovation creates a concave-up pixel surface, which is then overlaid with a high transmittance planarizing film, optimizing light collection to the photodiode without the need for conventional microlenses. The design not only protects the imager from potential damage during cleaning processes but also minimizes topographical variations that could lead to reflection losses, thus enhancing image quality. This patent demonstrates Yang-Tung Fan's commitment to advancing imaging technology.

Career Highlights: Yang-Tung Fan's career is marked by his association with Taiwan Semiconductor Manufacturing Company Limited (TSMC), where he has contributed significantly to the advancement of semiconductor technology. His expertise has garnered recognition and respect within the industry, leading to numerous patents that address critical challenges faced in microelectronics.

Collaborations: Throughout his career, Yang-Tung Fan has collaborated with esteemed colleagues, including Cheng-Yu Chu and Yen-Ming Chen. These partnerships have facilitated the exchange of ideas and fostered innovation in their respective fields, further enhancing the impact of their collective work on microelectronic devices.

Conclusion: Yang-Tung Fan’s inventive work and substantial patent portfolio signify his dedication to pushing the boundaries of microelectronic fabrication. His recent innovations, particularly in improving imaging technology, not only contribute to the success of Taiwan Semiconductor Manufacturing Company Limited but also solidify his reputation as a leading inventor in the field. As technology continues to evolve, Yang-Tung Fan's contributions will undoubtedly play a crucial role in shaping the future of microelectronics.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]