The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2005
Filed:
May. 16, 2002
Kuo-wei Lin, Hsin-chu, TW;
Cheng-yu Chu, Hsinchu, TW;
Yen-ming Chen, Hsin-Chu, TW;
Yang-tung Fan, Jubei, TW;
Fu-jier Fan, Jubei, TW;
Chiou Shian Peng, Hsinchu, TW;
Shih-jang Lin, Hsinchu, TW;
Kuo-Wei Lin, Hsin-chu, TW;
Cheng-Yu Chu, Hsinchu, TW;
Yen-Ming Chen, Hsin-Chu, TW;
Yang-Tung Fan, Jubei, TW;
Fu-Jier Fan, Jubei, TW;
Chiou Shian Peng, Hsinchu, TW;
Shih-Jang Lin, Hsinchu, TW;
Abstract
A new method and processing sequence is provided for the creation of interconnect bumps. A layer of passivation is deposited over a contact pad and patterned, creating an opening in the layer of passivation that aligns with the contact pad. A layer of UBM metal is deposited over the layer of passivation, the layer of UBM is overlying the contact pad and limited to the immediate surroundings of the contact pad. The central surface of the layer of UBM is selectively electroplated after which a layer of solder or solder alloy is solder printed over the electroplated surface of the layer of UBM. A solder flux or paste is applied over the surface of the solder printed solder compound or solder alloy. Flowing of the solder or solder alloy creates the solder bump of the invention.