Shih-Jang Lin

Title: Innovations by Shih-Jang Lin

Introduction

Shih-Jang Lin is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of bumping technology. With a total of 4 patents to his name, Lin's work has had a substantial impact on the industry.

Latest Patents

One of Lin's latest patents is a method for dual-layer polyimide processing on bumping technology. This innovative method provides a new processing sequence for the formation of solder bumps that are in contact with underlying aluminum contact pads. A patterned layer of negative photoresist is interposed between a patterned layer of PE SiN and a patterned layer of polyamide insulator. This design prevents moisture from the polyamide insulator from contacting the aluminum contact pad, thereby avoiding corrosion. Another notable patent is a method to form very fine pitch solder bumps using electroplating techniques. This method involves depositing a layer of passivation over a contact pad and selectively electroplating a layer of UBM metal, followed by the application of solder or solder alloy to create the solder bump.

Career Highlights

Shih-Jang Lin is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to innovate and develop new technologies. His expertise in semiconductor manufacturing processes has positioned him as a key player in the industry.

Collaborations

Lin has collaborated with several notable colleagues, including Cheng-Yu Chu and Fu-Jier Fan, who have contributed to his research and development efforts.

Conclusion

Shih-Jang Lin's contributions to semiconductor technology through his innovative patents demonstrate his commitment to advancing the field. His work not only enhances manufacturing processes but also sets a foundation for future innovations in the industry.