The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2005
Filed:
May. 13, 2003
Fu-jier Fan, Jubei, TW;
Cheng-yu Chu, Hsinchu, TW;
Kuo Wei Lin, Hsinchu, TW;
Shih-jang Lin, Hsinchu, TW;
Yang-tung Fran, Jubei, TW;
Chiou-shian Peng, Hsinchu, TW;
Fu-Jier Fan, Jubei, TW;
Cheng-Yu Chu, Hsinchu, TW;
Kuo Wei Lin, Hsinchu, TW;
Shih-Jang Lin, Hsinchu, TW;
Yang-Tung Fran, Jubei, TW;
Chiou-Shian Peng, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Hsin-Chu, TW;
Abstract
A new method and processing sequence is provided for the formation of solder bumps that are in contact with underlying aluminum contact pads. A patterned layer of negative photoresist is interposed between a patterned layer of PE SiNand a patterned layer of polyamide insulator. The patterned negative photoresist partially overlays the aluminum contact pad and prevents contact between the layer of polyamide insulator and the aluminum contact pad. By forming this barrier no moisture that is contained in the polyamide insulator can come in contact with the aluminum contact pad, therefore no corrosion in the surface of the aluminum contact pad can occur.