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For the Inventor, By the Inventor

Hsinchu, Taiwan

Cheng-Yu Chu

USPTO Granted Patents = 23 

Average Co-Inventor Count = 5.8

ph-index = 12

Forward Citations = 407(Granted Patents)


Company Filing History:

goldMedal22 out of 40,739 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 9,150 
 
Industrial Technology Research Institute
 patents

Years Active: 2001-2023

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23 patents (USPTO):Explore Patents
1. 11654529 - Burr trimming device (2023-05-23),
2. 7816169 - Colors only process to reduce package yield loss (2010-10-19),
3. 7485906 - Colors only process to reduce package yield loss (2009-02-03),
4. 7183598 - Colors only process to reduce package yield loss (2007-02-27),
5. 6958546 - Method for dual-layer polyimide processing on bumping technology (2005-10-25),
6. 6956292 - Bumping process to increase bump height and to create a more robust bump structure (2005-10-18),
7. 6936923 - Method to form very a fine pitch solder bump using methods of electroplating (2005-08-30),
8. 6876049 - Colors only process to reduce package yield loss (2005-04-05),
9. 6765277 - Microelectronic fabrication with corrosion inhibited bond pad (2004-07-20),
10. 6712260 - Bump reflow method by inert gas plasma (2004-03-30),
11. 6649507 - Dual layer photoresist method for fabricating a mushroom bumping plating structure (2003-11-18),
12. 6632700 - Method to form a color image sensor cell while protecting the bonding pad structure from damage (2003-10-14),
13. 6605524 - Bumping process to increase bump height and to create a more robust bump structure (2003-08-12),
14. 6586323 - Method for dual-layer polyimide processing on bumping technology (2003-07-01),
15. 6583039 - Method of forming a bump on a copper pad (2003-06-24),

Title: The Innovative Journey of Cheng-Yu Chu

Introduction:

Cheng-Yu Chu, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Chu's latest patents include cutting-edge advancements in semiconductor technology, renewable energy solutions, and artificial intelligence systems, showcasing his versatility and forward-thinking approach.

Career Highlights:

Throughout his illustrious career, Cheng-Yu Chu has held key positions in leading tech companies, where he spearheaded research and development projects that have revolutionized various industries. His expertise in patent law has also been instrumental in protecting his inventions and ensuring their commercial success.

Collaborations:

Chu has collaborated with top research institutions and universities worldwide, fostering a culture of innovation and knowledge exchange. His partnerships with fellow inventors and industry experts have led to the creation of groundbreaking technologies that have reshaped the technological landscape.

Conclusion:

In conclusion, Cheng-Yu Chu's relentless pursuit of innovation and his passion for pushing the boundaries of technology have established him as a visionary inventor in the global innovation community. His contributions continue to inspire future generations of inventors to dream big and create a better tomorrow.

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