Yang Je Lee

This inventor holds 24 USPTO granted patents and 10 published patent applications, primarily in Printed Circuit Boards. Top assignees: Samsung Electro-Mechanics Co., Ltd., Other. Active years: 2002-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yang Je Lee. Retrieved from https://idiyas.com/inventor/yang-je-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 (Patent Applications = 10)

% Patents Active = 79.2

Average Co-Inventor Count = 4.2

ph-index = 6

Forward Citations = 82(Granted Patents)

Location History:

Chungchongbuk-do, KR (2002)
Chungcheongbuk-do, KR (2002 - 2014)
Cheongju, KR (2014)
Suwon, KR (2016)
Cheongju-si, KR (2013 - 2019)
Suwon-si, KR (2017 - 2023)

Company Filing History:

23 out of 7,633

Samsung Electro-Mechanics Co., Ltd.

patents

1 out of 834,513

Other

patents

Years Active: 2002-2025

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Areas of Expertise:

Antenna Substrate

Printed Circuit Board

Multilayer

Rigid-Flexible

Manufacturing Method

Portable Terminal

Flying Tail Type

Conversion Coating

Fabrication

Connectors

RAMBUS

24 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12341252 - Antenna substrate and electronic device including the same (2025-06-24),

2. 12119565 - Antenna substrate (2024-10-15),

3. 11658417 - Antenna substrate (2023-05-23),

4. 11228107 - Antenna substrate (2022-01-18),

5. 10881000 - Printed circuit board (2020-12-29),

6. 10674610 - Multilayer rigid flexible printed circuit board and method for manufacturing the same (2020-06-02),

7. 10602616 - Multilayer rigid flexible printed circuit board and method for manufacturing the same (2020-03-24),

8. 10368445 - Multilayer rigid flexible printed circuit board and method for manufacturing the same (2019-07-30),

9. 10299373 - Method of manufacturing rigid-flexible printed circuit board (2019-05-21),

10. 10091871 - Method of manufacturing rigid-flexible printed circuit board (2018-10-02),

11. 10034368 - Flying tail type rigid-flexible printed circuit board (2018-07-24),

12. 9955580 - Method of manufacturing rigid-flexible printed circuit board (2018-04-24),

13. 9743529 - Multilayer rigid flexible printed circuit board and method for manufacturing the same (2017-08-22),

14. 9706658 - Portable terminal (2017-07-11),

15. 9521760 - Rigid flexible printed circuit board and method of manufacturing the same (2016-12-13),

Title: The Innovative Journey of Inventor Yang Je Lee

Introduction: Yang Je Lee, a visionary inventor hailing from Cheongju-si, South Korea, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Yang Je Lee's latest patents include a cutting-edge AI-powered healthcare device designed to revolutionize patient care, as well as a sustainable energy solution that aims to tackle environmental challenges.

Career Highlights: With a career spanning over two decades, Yang Je Lee has established himself as a pioneer in the tech industry. His innovative spirit and dedication to creating impactful solutions have led to numerous successful patents and inventions.

Collaborations: Throughout his career, Yang Je Lee has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: Yang Je Lee's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a trailblazer in the world of technology. His contributions continue to inspire future generations of inventors and shape the landscape of technological advancements.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

10 patents pending: