The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2016

Filed:

May. 20, 2014
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon, KR;

Inventors:

Yang Je Lee, Suwon, KR;

Jee Hoon Kim, Suwon, KR;

Jae Ho Shin, Suwon, KR;

Hyung Ju Cho, Suwon, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4691 (2013.01); Y10T 156/10 (2015.01);
Abstract

A rigid flexible printed circuit board, having a rigid region and a flexible region, includes, in one embodiment: a base substrate including a portion in the rigid region and a portion in the flexible region; a coverlay formed on the base substrate; a first insulating layer formed on the coverlay and formed in the rigid region; a second insulating layer formed on the first insulating layer; and an outer layer circuit layer formed on the second insulating layer. Also described is a method of manufacturing a rigid flexible printed circuit board having a rigid region and a flexible region.


Find Patent Forward Citations

Loading…