Samsung Electro-Mechanics Co., Ltd.

Other

Yang Je Lee

Dek Gin Yang

Jae Ho Shin

Dong Gi An

Hyun Kyung Park

Chang Gun Oh

Je Sang Park

Ha Il Kim

Chang Hyun Kim

Sang Ho Jeong

Going Sik Kim

Jong Hyung Kim

Kyeong Seon Chae

Gi Suk Kim

Il Woon Shin

Doo Pyo Hong

Myong Gun Chong

Byong Ho Lee

Hee Ju Park

Jung Hoon Jang

Han Bit Kim

Young Ho Lee

Yong Duk Lee

Mi Ja Han

Jung Wook Hwang

Keon Yang Park

Sung Wook Chun

Min Eui Hong

Jee Hoon Kim

Hyung Ju Cho

Kyu Hyok Yim

Jung Hun Chai

Deok Jin Yang

Kyu Hong An

Kwang Yune Kim

Jae Ok Lim

Sang Jin Oh

An antenna substrate includes: a first insulating layer surrounding a cavity; a second insulating layer of which at least a portion is disposed in the cavity and containing an insulating material different from an insulating material of the first insulating layer; a first patch antenna having one surface facing the first insulating layer by an amount greater than half of an area of the first patch antenna; and a second patch antenna having one surface facing the cavity by an amount greater than half of an area of the second patch antenna.

Antenna substrate and electronic device including the same

An antenna substrate includes a body in which a plurality of insulating layers are stacked, a first antenna layer including a plurality of first pattern layers disposed on the plurality of insulating layers and a plurality of first conductive via layer penetrating through the plurality of insulating layers to connect the plurality of first pattern layers in a stacking direction of the plurality of insulating layers and having a bar shape, and a second antenna layer extending from at least one of an uppermost portion or a lowermost portion of the first antenna layer on the insulating layer of the body.

Antenna substrate

An antenna substrate includes: a body having a first surface and a second surface opposing each other and a side surface connecting the first surface and the second surface to each other; an antenna portion disposed on the first surface of the body; and a pad portion disposed in the body, exposed to the side surface of the body, and including a plurality of pad layers connected to each other in a first direction from the second surface of the body toward the first surface of the body. At least one of the plurality of pad layers has a greater width in a second direction than in a third direction perpendicular to the second direction when viewed in the first direction.

An antenna substrate includes a body including an insulating material, a plurality of wiring layers stacked with each other in a first vertical direction in the body, and a plurality of first antenna layers stacked with each other in a third horizontal direction in the body. Each of the plurality of first antenna layers includes a plurality of conductive structures, each having a length in a second horizontal direction greater than a length in the third horizontal direction perpendicular to the second horizontal direction, that are stacked in the first vertical direction.

A printed circuit board includes a core layer having a first surface and a second surface opposing the first surface; a first built-up structure disposed on the first surface of the core layer; a second built-up structure disposed on the second surface of the core layer; and a first penetration portion penetrating the first built-up structure and the core layer and penetrating a portion of the second built-up structure. The first penetration portion has a step portion on at least a portion of a wall of the first penetration portion in the region of the first penetration portion penetrating the second built-up structure, and a region including the first penetration portion on a plane is configured as a flexible region.

Printed circuit board

The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

Multilayer rigid flexible printed circuit board and method for manufacturing the same

A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

Method of manufacturing rigid-flexible printed circuit board

The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.

Flying tail type rigid-flexible printed circuit board

A multilayer rigid flexible printed circuit board including a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

Disclosed herein is a portable terminal, including: a case; a first substrate disposed at one side of the case; a second substrate spaced from the first substrate to form a battery installing space; and a connection substrate electrically connecting between the first substrate and the second substrate and disposed in parallel with a side of the case.

Portable terminal

A rigid flexible printed circuit board, having a rigid region and a flexible region, includes, in one embodiment: a base substrate including a portion in the rigid region and a portion in the flexible region; a coverlay formed on the base substrate; a first insulating layer formed on the coverlay and formed in the rigid region; a second insulating layer formed on the first insulating layer; and an outer layer circuit layer formed on the second insulating layer. Also described is a method of manufacturing a rigid flexible printed circuit board having a rigid region and a flexible region.

Rigid flexible printed circuit board and method of manufacturing the same

Growing community of inventors

Cheongju-si, South Korea

Yang Je Lee